In 2012, global semiconductor sales
fell 2.7%; semiconductor equipment spending dropped by 15% to US$36.9
billion from US$43.5 billion in 2011. The semiconductor market in 2013
is also not optimistic, accompanied by recession of the world’s emerging
economies and Europe’s sluggish recovery. U.S. and Japanese markets are
relatively better, while China, as the world’s largest semiconductor
market, has witnessed lower-than-expected economic growth, the global
economy is yet to show signs of recovery.
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In spite of the overall decline in
semiconductor industry, the foundry field still grows. In 2012, the
global semiconductor foundry market reached total value of US$34.6
billion, an increase of 6.5% over 2011. With the growth slowdown of
smart phones and tablet PCs, it is expected that the foundry market in
2013 will increase by just 1.6% to exceed about US$35.2 billion.
With foundries as main customers,
advanced packaging vendors were therefore essentially flat or slightly
enhanced in 2012, the same expected in 2013. The fall in price of gold,
the indispensable raw material for advanced packaging vendors,
especially LCD Driver IC packaging companies, will improve the profit
margin of advanced packaging vendors in 2013.
Vendors located in Malaysia and
Singapore all showed decline, on account of the decreasing revenue of
foundries in this region. Taiwanese peers saw moderate growth except
memory package, chiefly benefiting from the strong drive of TSMC and
UMC. South Korean companies were boosted by Samsung.
Among Japanese companies, J-devices
experienced the highest growth, mainly owing to the back-end packaging
business purchased from Fujitsu. In January, 2013, Japan’s largest
semiconductor vendor – Renesas also sold three back-end packaging
factories to J-devices, which would usher in amazing growth in the
coming year, with expected annual revenue in FY2013 and FY2017
outnumbering JPY100 billion and JPY250 billion, respectively.
Taiwan-based Chipbond, the world’s
largest LCD Driver IC packaging vendor, will be another eye-catching
performer in 2013. The significantly enhanced screen resolution of
mobile phone and tablet PC will greatly raise Chipbond’s earnings, and
the decline in gold prices makes it the biggest beneficiary. In order to
further improve the industrial chain layout, Chipbond acquired the COF
substrate vendor - SIMPAL Electronics on May 2, 2013.
In addition, Chipbond is the advanced
packaging vendor with the highest operating margin, i.e. 16.7% in 2011
and 21.9% in 2012, but also the unique one with operating margin growth.
ASE closely followed in terms of operating margin, who benefitted from
its large customer TSMC that produced the world’s state-of-the-art IC.
Chinese Mainland counterparts
performed poorly, although JECT’s revenue saw substantial growth, yet
its operating margin fell sharply from 1.8% in 2011 to 0.2% in 2012,
slipping to the edge of loss.
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